Materials for advanced packaging 
edited by Daniel Lu, C.P. Wong. 
 - Boston, MA :  Springer US,  2009. 
 - xii, 316 p. :  ill., digital ;  24 cm. 
<br/><br/><label>ISBN: </label>9780387782195 (electronic bk.) 9780387782188 (paper) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Packaging--Materials.<br/>Microelectronic packaging.<br/>Material Science.<br/>Electronics and Microelectronics, Instrumentation.<br/>Metallic Materials.<br/>Nanotechnology.<br/>Optical and Electronic Materials.
<br/><br/><label>LC Class. No.: </label>TK7874  / .M38 2009 
<br/><br/><label>Dewey Class. No.: </label>621.381046  / MAD