TY - BOOK AU - Lu,Daniel AU - Wong,C.P TI - Materials for advanced packaging SN - 9780387782195 (electronic bk.) AV - TK7874 .M38 2009 U1 - 621.381046 22 PY - 2009/// CY - Boston, MA PB - Springer US KW - Packaging KW - Materials KW - Microelectronic packaging KW - Material Science KW - Electronics and Microelectronics, Instrumentation KW - Metallic Materials KW - Nanotechnology KW - Optical and Electronic Materials ER -