TY  - BOOK
AU  - Gilleo,Ken
TI  - Area array packaging materials: adhesives, pastes, and lead-free 
SN  - 9780071428286
AV  - TK7870.15 .A75 2004
U1  - 621.381046 22
PY  - 2004///
CY  - New York
PB  - McGraw-Hill
KW  - Ball grid array technology
KW  - Microelectronic packaging
KW  - Electronic packaging
KW  - Materials
N1  - Includes bibliographical references and index
ER  -