| 000 | 01130nam a2200349 a 4500 | ||
|---|---|---|---|
| 003 | BUC | ||
| 005 | 20220404070845.0 | ||
| 008 | 200121s2009 mau g j eng d | ||
| 020 | _a9780387782195 (electronic bk.) | ||
| 020 | _a9780387782188 (paper) | ||
| 040 |
_aBADR UNIVERSITY IN CAIRO _beng _cBADR UNIVERSITY IN CAIRO _erda |
||
| 041 | _aeng | ||
| 050 | 4 |
_aTK7874 _b.M38 2009 |
|
| 082 | 0 | 4 |
_a621.381046 _222 _bMAD |
| 245 | 0 | 0 |
_aMaterials for advanced packaging _cedited by Daniel Lu, C.P. Wong. |
| 260 |
_aBoston, MA : _bSpringer US, _c2009. |
||
| 300 |
_axii, 316 p. : _bill., digital ; _c24 cm. |
||
| 590 | _aSpringer. | ||
| 650 | 0 |
_aPackaging _xMaterials. |
|
| 650 | 0 | _aMicroelectronic packaging. | |
| 650 | 1 | 4 | _aMaterial Science. |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aMetallic Materials. |
| 650 | 2 | 4 | _aNanotechnology. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 700 | 1 |
_aLu, Daniel, _e editor. |
|
| 700 | 1 |
_aWong, C.P, _e editor. |
|
| 902 | _aN.Tolba | ||
| 942 |
_2ddc _cBK |
||
| 999 |
_c2221 _d2221 |
||