| 000 | 00876nam a2200277Ia 4500 | ||
|---|---|---|---|
| 003 | BUC | ||
| 005 | 20221105081102.0 | ||
| 008 | 200318s2004 nyua g b 001 0 eng d | ||
| 010 | _a2003070174 | ||
| 020 | _a9780071428286 | ||
| 040 |
_aBADR UNIVERSITY IN CAIRO _cBADR UNIVERSITY IN CAIRO _beng _erda |
||
| 041 | 0 | _aeng | |
| 050 | 0 | 0 |
_aTK7870.15 _b.A75 2004 |
| 082 |
_222 _a621.381046 _bAAR |
||
| 245 | 0 | 0 |
_aArea array packaging materials : _badhesives, pastes, and lead-free / _cKen Gilleo, editor. |
| 260 |
_aNew York : _bMcGraw-Hill, _cc2004 |
||
| 300 |
_aviii, 166 p. : _bill. ; _c25 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 | _aBall grid array technology. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 650 | 0 |
_aElectronic packaging _xMaterials. |
|
| 700 | 1 | _aGilleo, Ken. | |
| 902 | _aN.Tolba | ||
| 942 |
_2ddc _cBK |
||
| 999 |
_c4813 _d4813 |
||