000			00776cam a22002654a 4500
999			_c6105 _d6105
001			13422399
003			BUC
005			20200914135028.0
008			200607s2004 nyua g 001 0 eng d
010			_a2003069085
020			_a0071428275
020			_a9780071428279
040			_aDLC _cDLC _dDLC _beng
041			_aeng
050	0	0	_aTK7870.15 _b.A74 2004
082	0	4	_a621.381046 _222 _bARA
245	0	0	_aArea array package design : _btechniques in high-density electronics / _cKen Gilleo, ed.
260			_aNew York : _bMcGraw-Hill, _cc2004.
300			_axii, 204 p. : _bill. ; _c25 cm.
440		0	_aMcGraw-Hill engineering reference guide series
500			_aIncludes index.
650		0	_aElectronic packaging _xDesign.
700	1		_aGilleo, Ken.
942			_2ddc _cBK