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Materials for advanced packaging

Materials for advanced packaging edited by Daniel Lu, C.P. Wong. - Boston, MA : Springer US, 2009. - xii, 316 p. : ill., digital ; 24 cm.

ISBN: 9780387782195 (electronic bk.) 9780387782188 (paper)

Subjects--Topical Terms:
Packaging--Materials.
Microelectronic packaging.
Material Science.
Electronics and Microelectronics, Instrumentation.
Metallic Materials.
Nanotechnology.
Optical and Electronic Materials.

LC Class. No.: TK7874 / .M38 2009

Dewey Class. No.: 621.381046 / MAD

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