Area array packaging materials : adhesives, pastes, and lead-free / Ken Gilleo, editor.
Material type:
TextLanguage: English Publication details: New York : McGraw-Hill, c2004Description: viii, 166 p. : ill. ; 25 cmISBN: 9780071428286Subject(s): Ball grid array technology | Microelectronic packaging | Electronic packaging -- MaterialsDDC classification: 621.381046 LOC classification: TK7870.15 | .A75 2004
| Item type | Current library | Home library | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
Books
|
School of Engineering and Technology | School of Engineering and Technology | 621.381046 AAR (Browse shelf (Opens below)) | Available | 2566 |
Total holds: 0
Browsing School of Engineering and Technology shelves Close shelf browser (Hides shelf browser)
|
|
|
|
|
|
|
||
| 621.381 HAM MEMS reliability | 621.381 TPH Theory and phenomena of metamaterials / | 621.3810321 MCH McGraw-Hill dictionary of electronics and computer technology / | 621.381046 AAR Area array packaging materials : adhesives, pastes, and lead-free / | 621.381046 ARA Area array package design : | 621.381046 MAD Materials for advanced packaging | 621.3813 BJE Engineering applications of the modulated scatterer technique / |
Includes bibliographical references and index.
There are no comments on this title.