Area array package design : techniques in high-density electronics / Ken Gilleo, ed.
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TextLanguage: English Series: McGraw-Hill engineering reference guide seriesPublication details: New York : McGraw-Hill, c2004Description: xii, 204 p. : ill. ; 25 cmISBN: 0071428275; 9780071428279Subject(s): Electronic packaging -- DesignDDC classification: 621.381046 LOC classification: TK7870.15 | .A74 2004
| Item type | Current library | Home library | Call number | Status | Date due | Barcode | Item holds |
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School of Engineering and Technology | School of Engineering and Technology | 621.381046 ARA (Browse shelf (Opens below)) | Available | 2838 |
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| 621.381 TPH Theory and phenomena of metamaterials / | 621.3810321 MCH McGraw-Hill dictionary of electronics and computer technology / | 621.381046 AAR Area array packaging materials : adhesives, pastes, and lead-free / | 621.381046 ARA Area array package design : | 621.381046 MAD Materials for advanced packaging | 621.3813 BJE Engineering applications of the modulated scatterer technique / | 621.3813 MKM Microwave engineering / |
Includes index.
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