Your search returned 3 results.

Not what you expected? Check for suggestions

Results
		Area array packaging materials : adhesives, pastes, and lead-free / Ken Gilleo, editor. by Gilleo, Ken. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Language: English Publication details: New York : McGraw-Hill, c2004Availability: Items available for loan: School of Engineering and Technology (1) Call number: 621.381046 AAR. Place hold Log in to add tags Add to cart (remove)
		Area array package design : techniques in high-density electronics / Ken Gilleo, ed. by Gilleo, Ken. Series: McGraw-Hill engineering reference guide seriesMaterial type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Language: English Publication details: New York : McGraw-Hill, c2004Availability: Items available for loan: School of Engineering and Technology (1) Call number: 621.381046 ARA. Place hold Log in to add tags Add to cart (remove)
		Area array packaging processes : for BGA, Flip Chip, and CSP / Ken Gilleo, editor. by Gilleo, Ken. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Language: English Publication details: New York : McGraw-Hill, c2004Availability: Items available for loan: School of Engineering and Technology (1) Call number: 621.381/046. Place hold Log in to add tags Add to cart (remove)

Refine your search