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		Materials for advanced packaging edited by Daniel Lu, C.P. Wong. by Lu, Daniel [ editor.] \| Wong, C.P [ editor.]. Material type: Text; Format: print ; Audience: General; Language: English Publication details: Boston, MA : Springer US, 2009Availability: Items available for loan: School of Engineering and Technology (1) Call number: 621.381046 MAD. Place hold Log in to add tags Add to cart (remove)
		Area array packaging materials : adhesives, pastes, and lead-free / Ken Gilleo, editor. by Gilleo, Ken. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Language: English Publication details: New York : McGraw-Hill, c2004Availability: Items available for loan: School of Engineering and Technology (1) Call number: 621.381046 AAR. Place hold Log in to add tags Add to cart (remove)
		Area array packaging processes : for BGA, Flip Chip, and CSP / Ken Gilleo, editor. by Gilleo, Ken. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Language: English Publication details: New York : McGraw-Hill, c2004Availability: Items available for loan: School of Engineering and Technology (1) Call number: 621.381/046. Place hold Log in to add tags Add to cart (remove)

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