Materials for advanced packaging edited by Daniel Lu, C.P. Wong.
Material type:
TextLanguage: English Publication details: Boston, MA : Springer US, 2009Description: xii, 316 p. : ill., digital ; 24 cmISBN: 9780387782195 (electronic bk.); 9780387782188 (paper)Subject(s): Packaging -- Materials | Microelectronic packaging | Material Science | Electronics and Microelectronics, Instrumentation | Metallic Materials | Nanotechnology | Optical and Electronic MaterialsDDC classification: 621.381046 LOC classification: TK7874 | .M38 2009
| Item type | Current library | Home library | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
Books
|
School of Engineering and Technology | School of Engineering and Technology | 621.381046 MAD (Browse shelf (Opens below)) | Available | 2224 |
Total holds: 0
Browsing School of Engineering and Technology shelves Close shelf browser (Hides shelf browser)
|
|
|
|
|
|
|
||
| 621.3810321 MCH McGraw-Hill dictionary of electronics and computer technology / | 621.381046 AAR Area array packaging materials : adhesives, pastes, and lead-free / | 621.381046 ARA Area array package design : | 621.381046 MAD Materials for advanced packaging | 621.3813 BJE Engineering applications of the modulated scatterer technique / | 621.3813 MKM Microwave engineering / | 621.3813 RRM Microwave engineering / |
Springer.
There are no comments on this title.