Materials for advanced packaging edited by Daniel Lu, C.P. Wong.
Material type:
TextLanguage: English Publication details: Boston, MA : Springer US, 2009Description: xii, 316 p. : ill., digital ; 24 cmISBN: 9780387782195 (electronic bk.); 9780387782188 (paper)Subject(s): Packaging -- Materials | Microelectronic packaging | Material Science | Electronics and Microelectronics, Instrumentation | Metallic Materials | Nanotechnology | Optical and Electronic MaterialsDDC classification: 621.381046 LOC classification: TK7874 | .M38 2009
| Item type | Current library | Home library | Call number | Status | Date due | Barcode | Item holds |
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School of Engineering and Technology | School of Engineering and Technology | 621.381046 MAD (Browse shelf (Opens below)) | Available | 2224 |
Total holds: 0
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